大功率微波(bo)芯片自动共晶焊接技术（摘录）

转自：微组(zu)装领域知识研讨(tao)分享；来源(yuan)：众望(wang)微组(zu)装；作(zuo)者：南京胡永芳研究员、韩宗杰研究员

  大功率GaAs 微波器件因(yin)其(qi)优越的性能(neng)而在相控阵(zhen)雷达、微波通信系统(tong)等领(ling)域得到广泛应用。大功率GaAs 微波(bo)芯片体积小，重(zhong)量轻，具有(you)优良的(de)高频特性及高可靠(kao)性，已成为有(you)源固态(tai)相控(kong)阵雷达T/R 组件(jian)的关键器件(jian)。

  微(wei)(wei)(wei)波电(dian)(dian)路通常频率较高，因此(ci)芯片(pian)的接地状况影响着(zhe)电(dian)(dian)路串扰和插入损耗，同时也带来了附加电(dian)(dian)容(rong)与(yu)振荡。微(wei)(wei)(wei)波组件发射部(bu)分的大功率微(wei)(wei)(wei)波芯片(pian)的GaAs基体(ti)材料导热性能(neng)差，因此(ci)大(da)功率微(wei)波芯片与基体(ti)（基板）的(de)(de)连接(jie)(jie)必须要有良好(hao)的(de)(de)微(wei)波接(jie)(jie)地能(neng)力(li)（低欧(ou)姆接(jie)(jie)触）和(he)良好(hao)的(de)(de)散(san)热能(neng)力(li)，选(xuan)用(yong)合金(jin)焊料进行共(gong)晶焊接(jie)(jie)是国内(nei)外(wai)一致采用(yong)的(de)(de)芯片贴装方式。

  在大功(gong)率微波芯片共晶(jing)焊接效果(guo)评价中，焊透率（被钎接面积/需焊接面积(ji)）直接反(fan)映了接地效果(guo)和散热能力，是整个焊接技术的重要指标。

  本(ben)研究采用自动化(hua)手段实现大功(gong)(gong)率(lv)微波芯(xin)片(pian)(pian)高可靠共(gong)晶焊接(jie)，对(dui)影响大功(gong)(gong)率(lv)微波芯(xin)片(pian)(pian)焊接(jie)焊透(tou)率(lv)的温度曲(qu)线、焊片(pian)(pian)尺寸、氮气(qi)保护气(qi)氛、摩擦(ca)次数等影响因素分别进行了研究，以期获得大功(gong)(gong)率(lv)微波芯(xin)片(pian)(pian)共(gong)晶焊接(jie)良(liang)好的焊透(tou)率(lv)。

  试(shi)验原理：采(cai)用Au80Sn20焊料，共晶熔点(dian)280度。钎焊温度为300-310度，比共晶熔点(dian)高出20-30度。（下(xia)次看哪(na)位材料高手，普及一下(xia)如何看合(he)金相图）

试验材料：试验材料包括：

1）GaAs微波芯片，厚(hou)0.08 mm； 

2）模(mo)拟匹配陶(tao)瓷片为 Al2O3，厚 0.5 mm，待焊(han)接面(mian)镀金；

3）热沉为 Mo70Cu30 合(he)金，厚 0.4 mm。

试验(yan)方法：依据金(jin)锡(xi)共晶焊(han)(han)接(jie)的(de)(de)(de)(de)原理，同时(shi)考(kao)虑(lv)到大(da)功率(lv)微(wei)(wei)(wei)波(bo)芯(xin)片(pian)(pian)的(de)(de)(de)(de)散热(re)(re)要求(qiu)(qiu)和热(re)(re)膨胀系(xi)数(shu)匹配以及微(wei)(wei)(wei)波(bo)电路系(xi)统组装焊(han)(han)接(jie)的(de)(de)(de)(de)兼容性（分级焊(han)(han)接(jie)），研(yan)究(jiu)预(yu)置共晶焊(han)(han)料、焊(han)(han)接(jie)温度曲线(xian)、氮气保护(hu)气氛以及摩(mo)擦次数(shu)等(deng)因素对微(wei)(wei)(wei)波(bo)芯(xin)片(pian)(pian)共晶焊(han)(han)接(jie)的(de)(de)(de)(de)影(ying)响(xiang)，以期获得90%以上的(de)(de)(de)(de)芯(xin)片(pian)(pian)焊(han)(han)透(tou)率(lv)，满足产品研(yan)制生产的(de)(de)(de)(de)需求(qiu)(qiu)。最后(hou)，选取共晶焊(han)(han)接(jie)焊(han)(han)透(tou)率(lv)好的(de)(de)(de)(de)大(da)功率(lv)微(wei)(wei)(wei)波(bo)芯(xin)片(pian)(pian)进(jin)行(xing)热(re)(re)循(xun)环试验(yan)，对不(bu)同循(xun)环次数(shu)下(xia)的(de)(de)(de)(de)芯(xin)片(pian)(pian)进(jin)行(xing)剪(jian)切力(li)测试，分析不(bu)同循(xun)环次数(shu)下(xia)的(de)(de)(de)(de)芯(xin)片(pian)(pian)剪(jian)切力(li)的(de)(de)(de)(de)变(bian)化规律。

试验结果(guo)与分(fen)析

1.  预(yu)置(zhi)金锡合金焊料(liao)层

       共(gong)(gong)(gong)晶(jing)(jing)焊(han)(han)(han)(han)接(jie)(jie)过程中，金(jin)(jin)(jin)(jin)锡(xi)(xi)焊(han)(han)(han)(han)料(liao)的(de)(de)(de)用量对大(da)功率微波芯(xin)片的(de)(de)(de)焊(han)(han)(han)(han)透率和焊(han)(han)(han)(han)料(liao)流淌有直接(jie)(jie)的(de)(de)(de)影(ying)响(xiang)。采用常(chang)规的(de)(de)(de)熔铸-轧制(zhi)(zhi)方(fang)法制(zhi)(zhi)备(bei)的(de)(de)(de)金(jin)(jin)(jin)(jin)锡(xi)(xi)预成型焊(han)(han)(han)(han)片厚(hou)度通常(chang)大(da)于15um，在大(da)功率微波芯(xin)片散(san)热(re)(re)通路中热(re)(re)阻较(jiao)大(da)，易(yi)发生热(re)(re)量积累而导致芯(xin)片过热(re)(re)乃至(zhi)失效(xiao)。采用分层电镀技术在MoCu热(re)(re)沉上(shang)制(zhi)(zhi)作了(le)(le)(le)5um厚(hou)的(de)(de)(de)金(jin)(jin)(jin)(jin)锡(xi)(xi)共(gong)(gong)(gong)晶(jing)(jing)焊(han)(han)(han)(han)料(liao)层，优化(hua)(hua)确定MoCu热(re)(re)沉上(shang)的(de)(de)(de)Ni-Au-Sn膜层结构，考察了(le)(le)(le)金(jin)(jin)(jin)(jin)层、锡(xi)(xi)层的(de)(de)(de)膜厚(hou)对金(jin)(jin)(jin)(jin)锡(xi)(xi)合(he)(he)(he)金(jin)(jin)(jin)(jin)的(de)(de)(de)影(ying)响(xiang)。试(shi)验表(biao)明(ming)：金(jin)(jin)(jin)(jin)层和锡(xi)(xi)层的(de)(de)(de)厚(hou)度直接(jie)(jie)决定了(le)(le)(le)金(jin)(jin)(jin)(jin)锡(xi)(xi)合(he)(he)(he)金(jin)(jin)(jin)(jin)的(de)(de)(de)含量，金(jin)(jin)(jin)(jin)层、锡(xi)(xi)层在合(he)(he)(he)适的(de)(de)(de)厚(hou)度下能得(de)到共(gong)(gong)(gong)晶(jing)(jing)点的(de)(de)(de)金(jin)(jin)(jin)(jin)锡(xi)(xi)合(he)(he)(he)金(jin)(jin)(jin)(jin)；金(jin)(jin)(jin)(jin)含量偏高时(shi)，合(he)(he)(he)金(jin)(jin)(jin)(jin)熔化(hua)(hua)温(wen)(wen)度明(ming)显(xian)变高，制(zhi)(zhi)备(bei)的(de)(de)(de)合(he)(he)(he)金(jin)(jin)(jin)(jin)不(bu)具有实用价值；锡(xi)(xi)含量偏高时(shi)，合(he)(he)(he)金(jin)(jin)(jin)(jin)熔化(hua)(hua)温(wen)(wen)度变化(hua)(hua)较(jiao)小。通过试(shi)验研究了(le)(le)(le)热(re)(re)处理(li)工艺对预置(zhi)AuSn焊(han)(han)(han)(han)料(liao)合(he)(he)(he)金(jin)(jin)(jin)(jin)的(de)(de)(de)影(ying)响(xiang)，结果表(biao)明(ming)热(re)(re)处理(li)温(wen)(wen)度在350度时(shi)可达到较(jiao)好(hao)的(de)(de)(de)合(he)(he)(he)金(jin)(jin)(jin)(jin)化(hua)(hua)效(xiao)果。对金(jin)(jin)(jin)(jin)锡(xi)(xi)共(gong)(gong)(gong)晶(jing)(jing)薄膜的(de)(de)(de)性能做了(le)(le)(le)评估测试(shi)。表(biao)明(ming)，在MoCu热(re)(re)沉上(shang)制(zhi)(zhi)备(bei)的(de)(de)(de)金(jin)(jin)(jin)(jin)锡(xi)(xi)共(gong)(gong)(gong)晶(jing)(jing)薄膜的(de)(de)(de)成分可控制(zhi)(zhi)在Au=80+/-1%,Sn=20+/-1%,薄膜可焊(han)(han)(han)(han)性良好(hao)，满足产(chan)品AuSn共(gong)(gong)(gong)晶(jing)(jing)焊(han)(han)(han)(han)接(jie)(jie)的(de)(de)(de)需求。

2. 焊接(jie)温度曲线设(she)计

      Au80Sn20焊(han)(han)(han)料的(de)(de)熔点为280度(du)(du)(du)(du)(du)(du)，焊(han)(han)(han)接(jie)(jie)(jie)时温(wen)(wen)度(du)(du)(du)(du)(du)(du)范(fan)围(wei)一(yi)般为300-310度(du)(du)(du)(du)(du)(du)，以(yi)保证焊(han)(han)(han)料具(ju)有(you)较好的(de)(de)可(ke)(ke)焊(han)(han)(han)性。大(da)功(gong)率(lv)(lv)(lv)微(wei)波芯片对(dui)温(wen)(wen)度(du)(du)(du)(du)(du)(du)敏(min)感，一(yi)般焊(han)(han)(han)接(jie)(jie)(jie)温(wen)(wen)度(du)(du)(du)(du)(du)(du)不超过(guo)(guo)(guo)310度(du)(du)(du)(du)(du)(du)，焊(han)(han)(han)接(jie)(jie)(jie)时间(jian)(jian)不能超过(guo)(guo)(guo)30S，否则会导致芯片性能下降，因此，焊(han)(han)(han)接(jie)(jie)(jie)的(de)(de)温(wen)(wen)度(du)(du)(du)(du)(du)(du)曲线(xian)(xian)设(she)计非常(chang)重(zhong)要。自动(dong)共晶焊(han)(han)(han)接(jie)(jie)(jie)设(she)备(bei)配(pei)置了可(ke)(ke)编(bian)(bian)程(cheng)脉冲加热台，可(ke)(ke)以(yi)对(dui)温(wen)(wen)度(du)(du)(du)(du)(du)(du)曲线(xian)(xian)进(jin)行精确控(kong)制(zhi)，从而大(da)大(da)提高焊(han)(han)(han)接(jie)(jie)(jie)的(de)(de)可(ke)(ke)靠性。可(ke)(ke)编(bian)(bian)辑脉冲加热台主要通(tong)(tong)过(guo)(guo)(guo)升温(wen)(wen)速率(lv)(lv)(lv)、最(zui)高温(wen)(wen)度(du)(du)(du)(du)(du)(du)和持续(xu)(xu)时间(jian)(jian)来(lai)编(bian)(bian)制(zhi)温(wen)(wen)度(du)(du)(du)(du)(du)(du)程(cheng)序(xu)，试验选取(qu)了多种参数(shu)进(jin)行组合，得到不同的(de)(de)温(wen)(wen)度(du)(du)(du)(du)(du)(du)曲线(xian)(xian)，通(tong)(tong)过(guo)(guo)(guo)焊(han)(han)(han)接(jie)(jie)(jie)过(guo)(guo)(guo)程(cheng)中的(de)(de)焊(han)(han)(han)料溢出、焊(han)(han)(han)透率(lv)(lv)(lv)、芯片破裂等(deng)结果对(dui)焊(han)(han)(han)接(jie)(jie)(jie)曲线(xian)(xian)进(jin)行评价，最(zui)终确定最(zui)适合大(da)功(gong)率(lv)(lv)(lv)微(wei)波芯片焊(han)(han)(han)接(jie)(jie)(jie)的(de)(de)温(wen)(wen)度(du)(du)(du)(du)(du)(du)曲线(xian)(xian)参数(shu)：升温(wen)(wen)速度(du)(du)(du)(du)(du)(du)10度(du)(du)(du)(du)(du)(du)/S,最(zui)高温(wen)(wen)度(du)(du)(du)(du)(du)(du)310度(du)(du)(du)(du)(du)(du)，持续(xu)(xu)时间(jian)(jian)7S。

3. 氮气(qi)气(qi)氛保护的(de)影响

      在大功(gong)率微波芯片(pian)的焊(han)(han)接(jie)过(guo)(guo)(guo)程(cheng)中进行局(ju)部氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)气(qi)(qi)(qi)(qi)(qi)(qi)氛保护(hu)(hu)，一个半密封氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)保护(hu)(hu)罩扣在脉冲加热台上(shang)(shang)方，充入(ru)氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)将空气(qi)(qi)(qi)(qi)(qi)(qi)排(pai)除以(yi)降低(di)(di)环境氧(yang)气(qi)(qi)(qi)(qi)(qi)(qi)含量(liang)(liang)(liang)。设备的氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流量(liang)(liang)(liang)在0-20L/min范(fan)围(wei)内可(ke)(ke)控。氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流量(liang)(liang)(liang)为0时(shi)(shi)，焊(han)(han)接(jie)过(guo)(guo)(guo)程(cheng)没有保护(hu)(hu)，金(jin)锡焊(han)(han)料容易形成氧(yang)化物残(can)渣，影响(xiang)焊(han)(han)接(jie)质(zhi)量(liang)(liang)(liang)甚至有可(ke)(ke)能影响(xiang)产品可(ke)(ke)靠性，当氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流量(liang)(liang)(liang)提升(sheng)到(dao)(dao)5L/min以(yi)上(shang)(shang)时(shi)(shi)，半密封罩内能够(gou)排(pai)除氧(yang)气(qi)(qi)(qi)(qi)(qi)(qi)，保证共晶焊(han)(han)接(jie)在无(wu)氧(yang)气(qi)(qi)(qi)(qi)(qi)(qi)氛下完成，此时(shi)(shi)得到(dao)(dao)的金(jin)锡焊(han)(han)点明亮而有光泽(ze)、无(wu)氧(yang)化。氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流量(liang)(liang)(liang)继续提升(sheng)，到(dao)(dao)10L/min以(yi)上(shang)(shang)时(shi)(shi)，氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流速过(guo)(guo)(guo)大导致从加热台带走的热量(liang)(liang)(liang)过(guo)(guo)(guo)多，焊(han)(han)接(jie)温(wen)度开始出现(xian)不稳定现(xian)象。综上(shang)(shang)所述(shu)，设置(zhi)氮(dan)气(qi)(qi)(qi)(qi)(qi)(qi)流量(liang)(liang)(liang)5L/min即(ji)可(ke)(ke)保证排(pai)除氧(yang)气(qi)(qi)(qi)(qi)(qi)(qi)以(yi)提高焊(han)(han)接(jie)质(zhi)量(liang)(liang)(liang)，同时(shi)(shi)可(ke)(ke)最大程(cheng)度地节约成本，降低(di)(di)焊(han)(han)接(jie)热量(liang)(liang)(liang)损耗。

4. 摩擦次(ci)数的影响

      在大功率微波芯片自动(dong)共晶(jing)焊接时会有一个摩擦过(guo)程，

摩(mo)擦过(guo)(guo)程(cheng)有利(li)于金锡焊料表面的(de)氧化(hua)物(wu)破(po)除(chu)，有利(li)于焊料在(zai)芯片(pian)和(he)热(re)沉之间铺(pu)展，同时排(pai)除(chu)共晶焊接面的(de)气体，从(cong)而提高焊透率。大功率微波芯片(pian)焊接过(guo)(guo)程(cheng)中，在(zai)X和(he)Y方(fang)向(xiang)均可施加摩(mo)擦过(guo)(guo)程(cheng)。本试验中设(she)定(ding)X和(he)Y方(fang)向(xiang)摩(mo)擦交(jiao)替进行，两方(fang)向(xiang)合计摩(mo)擦次数与焊透率的(de)关系(xi)曲(qu)线(xian)

试验(yan)结果表明：当摩擦次数达(da)到30次时(shi)，焊(han)透率可以保证在(zai)90%以上，满足(zu)功放芯片的(de)散热要求；摩擦次数继(ji)续增(zeng)加，焊(han)透率提升比例有限。

使用上(shang)述试验确(que)定的(de)优化参数在(zai)热沉(chen)上(shang)完(wan)成大功率(lv)微波芯片、两(liang)个陶瓷(ci)片和两(liang)个连排电容的(de)焊接，各个器件之间的(de)距(ju)离(li)精度，能够控(kong)制(zhi)在(zai)25+/-5um的(de)范围(wei)内，焊透(tou)(tou)率(lv)能够达到90%以上(shang)，完(wan)全能够满足(zu)产品(pin)高(gao)精度高(gao)焊透(tou)(tou)率(lv)的(de)组装(zhuang)要求。

结束语

  本文(wen)研(yan)究(jiu)了大功率微波芯片共晶(jing)焊接(jie)技术，分别(bie)对(dui)影响微波芯片焊接(jie)焊透(tou)率的预置焊料、温度曲线(xian)、氮气保(bao)护气氛、摩擦次(ci)数等影响因(yin)素进行研(yan)究(jiu)，得到(dao)以下结论：

1）采用分(fen)层电镀(du)技(ji)术在(zai) MoCu 热沉上制作了(le) 5 µm 厚的(de)金锡共晶焊料层，可焊性(xing)良(liang)好，满足共晶焊接(jie)的(de)需(xu)求。

2）适(shi)合大功率(lv)微(wei)波芯(xin)片焊(han)接(jie)的温(wen)(wen)度曲线的参数为升(sheng)温(wen)(wen)速率(lv)10 度(du)/s，最(zui)高温(wen)度310 度(du)，持续时间 7 s

3）设置(zhi)氮气流量 5 L/min，能够保证(zheng)共晶焊(han)接(jie)在无(wu)氧气氛(fen)下完(wan)成(cheng)，此(ci)时得到(dao)的(de)金(jin)锡焊(han)点具(ju)有明(ming)亮(liang)的(de)金(jin)属光泽。

4）摩擦次(ci)数(shu)达到 30 次(ci)时，焊(han)透率能够(gou)达(da)到 90% 以上，焊接位置精度能够控制在(25 ± 5) µm 范围内，满足产品高精度高焊透率的组装要求。

5）焊后(hou)大功(gong)率微波(bo)芯片模块(kuai)的(de)(de)热循环试验(yan)结(jie)果表明，采(cai)用优(you)化的(de)(de)工艺参数(shu)获得的(de)(de)大功(gong)率微波(bo)芯片共晶焊接模块(kuai)具有较好(hao)的(de)(de)可(ke)靠性(xing)。

致(zhi)谢：南京胡永(yong)芳研(yan)究员(yuan)、韩宗杰研(yan)究员(yuan)的论文分(fen)享。

免责申(shen)明：本(ben)(ben)(ben)文内(nei)(nei)容转(zhuan)自(zi)：微(wei)组装领域(yu)知识研讨分(fen)享(xiang)；来源(yuan)：众望(wang)微(wei)组装；作者(zhe)(zhe)：南京胡永(yong)芳研究(jiu)(jiu)员、韩(han)宗杰研究(jiu)(jiu)员。文字、素材、图(tu)片版权等内(nei)(nei)容属于原(yuan)作者(zhe)(zhe)，本(ben)(ben)(ben)站转(zhuan)载内(nei)(nei)容仅供大家(jia)分(fen)享(xiang)学习。如果侵害了(le)原(yuan)著(zhu)作人(ren)的合法权益，请及时与我(wo)们联系，我(wo)们会安排(pai)删除相关(guan)内(nei)(nei)容。本(ben)(ben)(ben)文内(nei)(nei)容为原(yuan)作者(zhe)(zhe)观点，并不代表(biao)我(wo)们赞同其观点和（或）对其真实性负(fu)责。

先(xian)艺(yi)电子(zi)、XianYi、先(xian)艺(yi)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Au80Sn20焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Solder Preform、芯(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)供应(ying)商(shang)、芯(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)生产厂(chang)家、光伏焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)带、银(yin)基钎(qian)料(liao)(liao)、助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)膏(gao)、高温(wen)(wen)(wen)助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)剂(ji)(ji)、高温(wen)(wen)(wen)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)锡(xi)(xi)(xi)膏(gao)、flux paste、陶瓷绝(jue)缘(yuan)子(zi)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、气(qi)密(mi)性封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、激光器巴条封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、热沉、heatsink、IGBT大功率(lv)器件(jian)(jian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、光电子(zi)器件(jian)(jian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、MEMS器件(jian)(jian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)型锡(xi)(xi)(xi)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、纳(na)米(mi)银(yin)、纳(na)米(mi)银(yin)膏(gao)、微纳(na)连接(jie)(jie)(jie)技术、AuSn Alloy、TO-CAN封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、低(di)(di)温(wen)(wen)(wen)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)锡(xi)(xi)(xi)膏(gao)、喷(pen)印锡(xi)(xi)(xi)膏(gao)、银(yin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)膏(gao)、银(yin)胶、银(yin)浆、烧结银(yin)、低(di)(di)温(wen)(wen)(wen)银(yin)胶、银(yin)烧结、silver sinter paste、Ceramic submount、低(di)(di)温(wen)(wen)(wen)共晶焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)、低(di)(di)温(wen)(wen)(wen)合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Eutectic Solder、低(di)(di)温(wen)(wen)(wen)钎(qian)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)Au80Sn20焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、铟In合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、In97Ag3焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)银(yin)铜(tong)SAC焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)锑Sn90Sb10焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)铅Sn63Pb37焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)Au80Sn20预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Au80Sn20 Solder Preform、大功率(lv)LED芯(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)生产厂(chang)家、TO封(feng)(feng)(feng)帽封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、In52Sn48、铟银(yin)合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、纯铟焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)供应(ying)商(shang)、铟In合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)银(yin)铜(tong)SAC305（Sn96.5Ag3.0Cu0.5）焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)银(yin)铜(tong)预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)箔(bo)供应(ying)商(shang)、锡(xi)(xi)(xi)锑焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Sn90Sb10 Solder Preforms、锡(xi)(xi)(xi)铅焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)铅Sn63Pb37焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)供应(ying)商(shang)、锡(xi)(xi)(xi)铅Sn63Pb37焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)生产厂(chang)家、锡(xi)(xi)(xi)铅预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)选(xuan)型指南、低(di)(di)温(wen)(wen)(wen)合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)应(ying)用、低(di)(di)温(wen)(wen)(wen)合(he)(he)(he)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)如(ru)何选(xuan)择(ze)、预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)尺寸选(xuan)择(ze)、xianyi electronic、半导体芯(xin)(xin)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、光电成(cheng)(cheng)(cheng)像器件(jian)(jian)的盖板密(mi)封(feng)(feng)(feng)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)接(jie)(jie)(jie)、无(wu)助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)剂(ji)(ji)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、圆环预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、方框预(yu)(yu)(yu)(yu)成(cheng)(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)属化光纤连接(jie)(jie)(jie)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)基焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锗焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)硅焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)、器件(jian)(jian)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)料(liao)(liao)、预(yu)(yu)(yu)(yu)涂(tu)助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)剂(ji)(ji)、带助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)剂(ji)(ji)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)剂(ji)(ji)、共晶助(zhu)(zhu)焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)膏(gao)、预(yu)(yu)(yu)(yu)置焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)封(feng)(feng)(feng)装(zhuang)(zhuang)(zhuang)、箔(bo)状焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、预(yu)(yu)(yu)(yu)制焊(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)(han)锡(xi)(xi)(xi)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、预(yu)(yu)(yu)(yu)镀(du)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)、预(yu)(yu)(yu)(yu)涂(tu)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)

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