文章推荐 | 基于非牛顿流体的AuSn20密封空洞分析
文章推荐 | 基(ji)于非牛顿流体的AuSn20密(mi)封空洞分析
转(zhuan)自(zi):《电(dian)子(zi)与封装》
作者:赵鹤然1,3,李(li)俐莹(ying)2,陈明祥3
单位:1. 中国电子科技集(ji)团公司第四十(shi)七研究(jiu)所;2. 沈阳农业大(da)学(xue)(xue)信息与电气工程学(xue)(xue)院;3. 华(hua)中科技大(da)学(xue)(xue)机械科学(xue)(xue)与工程学(xue)(xue)院
摘要:金锡熔封是一种(zhong)典型(xing)的气密(mi)(mi)密(mi)(mi)封方式,广泛应(ying)用于高(gao)可靠集成电路工艺(yi)中。根据SJ 21455-2018《集成电路陶瓷封装合(he)(he)金烧结(jie)密(mi)(mi)封工艺(yi)技术要求》中的两种(zhong)夹持方式,通过结(jie)构力学仿(fang)(fang)真(zhen)计(ji)算(suan)得到(dao)了(le)熔封过程中外壳、盖板的应(ying)力应(ying)变情况。基(ji)于非(fei)牛顿流(liu)(liu)体流(liu)(liu)变特性(xing)和宾汉本构方程,采用流(liu)(liu)固(gu)耦合(he)(he)有(you)限元仿(fang)(fang)真(zhen),得到(dao)两种(zhong)夹持方式下(xia)熔融焊料的流(liu)(liu)动速度和流(liu)(liu)向流(liu)(liu)淌(tang)趋势,阐述了(le)四角空洞的一种(zhong)形成机理。
关键词(ci):金锡焊料(liao);密封;非牛顿(dun)流体;流固耦合;空洞
DOI: 10.16257/j.cnki.1681-1070.2021.1210
1 引(yin) 言
非(fei)牛(niu)(niu)顿(dun)流(liu)体(ti)(ti)(ti)是(shi)剪应力与剪切(qie)变(bian)形速率之间不(bu)满足线(xian)性(xing)关系的(de)(de)流(liu)体(ti)(ti)(ti)。自然界(jie)和工(gong)业界(jie)中(zhong)存在(zai)着大量(liang)非(fei)牛(niu)(niu)顿(dun)流(liu)体(ti)(ti)(ti),如沥青、水(shui)泥浆、污泥、奶油、蜂蜜、蛋白、大多数(shu)油类和润滑脂、高聚物熔(rong)体(ti)(ti)(ti)和溶液(ye)(ye)以及人体(ti)(ti)(ti)中(zhong)的(de)(de)血(xue)液(ye)(ye)等。在(zai)冶金熔(rong)炼(lian)过(guo)程中(zhong),金属熔(rong)体(ti)(ti)(ti)是(shi)气体(ti)(ti)(ti)、液(ye)(ye)体(ti)(ti)(ti)、固体(ti)(ti)(ti)三相流(liu)的(de)(de)非(fei)牛(niu)(niu)顿(dun)流(liu)体(ti)(ti)(ti),具有非(fei)牛(niu)(niu)顿(dun)流(liu)体(ti)(ti)(ti)以其自身(shen)复杂的(de)(de)流(liu)变(bian)性(xing)。
研究发现,金锡合金焊料(liao)加(jia)载条件下的变形(xing)量会受到(dao)压力和温度的影(ying)响。第一(yi)(yi)个(ge)阶(jie)段是弹性形(xing)变加(jia)塑性形(xing)变,接着是蠕变,然后(hou)是前(qian)两(liang)种的结合,最后(hou)是统一(yi)(yi)粘(zhan)塑性。熔融金锡焊料(liao)由Au、Sn、Ni等(deng)元素、难(nan)溶金属(shu)氧化物以及气泡(pao)等(deng)多(duo)相流体组成,对其流淌特性开展有(you)限元仿真分析(xi)时(shi),需要充分考(kao)虑其粘(zhan)度的非(fei)恒(heng)定特性。因此,构建非(fei)牛(niu)顿(dun)流体模(mo)型(xing)对分析(xi)金锡焊料密封行为是必要的。
AuSn焊料对外壳密封(feng)焊接面的(de)铺展和润湿是一个复杂的(de)过程,腔(qiang)体内(nei)外气压、夹具压力共同(tong)作用,求(qiu)解熔融焊料的(de)流(liu)淌趋(qu)势,基于非牛顿流(liu)体流(liu)变特性和宾汉本构方程,采用流(liu)固耦合有限元(yuan)仿真分析方法分析金(jin)锡(xi)焊料环加热熔化后的(de)流(liu)速和方向,并试(shi)着解释两种夹持方式外壳四角空洞的(de)形成机理(li)。
2 金锡(xi)焊(han)料的非牛顿模(mo)型
2.1 有(you)限(xian)元模型(xing)
图1为金(jin)锡熔封的封装模(mo)型(xing)示意图。其中,陶瓷基材(cai)是Al2O3陶瓷;金属盖板基材是(shi)Fe-Co-Ni可伐合金;金锡焊料环为AuSn20合金。外壳为(wei)CQPF240,密封区为方环形,内侧边长20.60 mm±0.25 mm,外侧(ce)边长(zhang)24.40 mm±0.25 mm,转(zhuan)角(jiao)处倒(dao)角(jiao)半径(jing)0.42 mm。
通过密封(feng)(feng)夹(jia)(jia)具对金(jin)属盖(gai)板施(shi)加(jia)密封(feng)(feng)压(ya)力(li),夹(jia)(jia)具类型选(xuan)用块(kuai)体(ti)和(he)夹(jia)(jia)子两种。盖(gai)板在(zai)夹(jia)(jia)具夹(jia)(jia)持作(zuo)用下发(fa)生轻(qing)微形变(bian),并将(jiang)密封(feng)(feng)压(ya)力(li)传递到金(jin)锡焊料(liao)(liao)环(huan)上。金(jin)锡焊料(liao)(liao)环(huan)与(yu)盖(gai)板的(de)(de)接(jie)(jie)触面被定(ding)义为(wei)压(ya)力(li)入口(kou)(kou);金(jin)锡焊料(liao)(liao)环(huan)与(yu)外(wai)(wai)壳腔(qiang)体(ti)内(nei)部(bu)气(qi)氛(fen)(fen)的(de)(de)接(jie)(jie)触面被定(ding)义为(wei)内(nei)部(bu)面,在(zai)密封(feng)(feng)过程中,腔(qiang)内(nei)气(qi)氛(fen)(fen)的(de)(de)压(ya)强随烧结(jie)温度(du)的(de)(de)变(bian)化而改变(bian),熔融(rong)的(de)(de)焊料(liao)(liao)流体(ti)与(yu)腔(qiang)内(nei)气(qi)氛(fen)(fen)的(de)(de)压(ya)强为(wei)竞争关系,占优(you)方决定(ding)焊料(liao)(liao)向(xiang)内(nei)流淌的(de)(de)方向(xiang)和(he)流速。金(jin)锡焊料(liao)(liao)环(huan)与(yu)腔(qiang)外(wai)(wai)气(qi)氛(fen)(fen)的(de)(de)接(jie)(jie)触面被定(ding)义为(wei)压(ya)力(li)出口(kou)(kou),由于(yu)烧结(jie)炉(lu)的(de)(de)氮(dan)气(qi)循环(huan),认为(wei)外(wai)(wai)部(bu)气(qi)氛(fen)(fen)的(de)(de)压(ya)强是恒(heng)定(ding)不变(bian)的(de)(de)。
2.2 流固(gu)耦合
由于(yu)压力的传导跨越了固(gu)体和流体两种介(jie)质,为了更(geng)精(jing)确(que)地开展模拟(ni),采用(yong)流固(gu)耦合的分析方法。
第一(yi)步,对(dui)盖(gai)板、外(wai)壳(qiao)、焊料(liao)环(huan)进行建模(mo),选择(ze)全(quan)六(liu)面体(ti)剖分(fen),节(jie)点数18729,单元(yuan)数15616,采(cai)用(yong)Static Structural模块,将温度载荷(he)和夹具压(ya)力(li)载荷(he)作为边界(jie)条件,求解压(ya)力(li)入口界(jie)面上各网格节点(dian)的压(ya)强分(fen)布。
第二步,建立流体区域模型,如图(tu)2所示。其中,腔体气(qi)体1为内部气(qi)氛不与焊料接触(chu)的部分;腔体气(qi)体2为内(nei)部(bu)(bu)气氛与焊(han)料(liao)接触的(de)部(bu)(bu)分;焊(han)料(liao)区(qu)域为熔融焊(han)料(liao)区(qu)域。采(cai)用Fluent模块,将稳态(tai)结构分析得(de)到的(de)压(ya)强分布结果导(dao)入流体模型的(de)压(ya)力入口网格节点上。根据焊料非(fei)牛顿力学特性,选择H-B模型,求解(jie)熔融焊料的(de)(de)(de)流(liu)动(dong)特性(xing)。由于求解(jie)区域(yu)涉及熔融的(de)(de)(de)焊料流(liu)体与腔内(nei)气氛(fen)的(de)(de)(de)压(ya)强竞争,选用两相流(liu)VOF模型(xing)求解问(wen)题。
2.3 宾汉(han)(Bingham)方(fang)程
2.4 材(cai)料(liao)属性
焊(han)料(liao)熔融、凝固(gu)过程(cheng)中会和腔内气体(ti)作用(yong),在夹具压力(li)作用(yong)下浸润(run)、铺平。如果确定了(le)焊(han)料(liao)的材料(liao)属性(xing)(xing)、流变(bian)特性(xing)(xing)、本构方程(cheng),即可仿真得(de)到(dao)焊(han)料(liao)在不(bu)同加载条件(jian)下的运动特征(zheng)及(ji)趋势。仿真所采用(yong)的AuSn20焊(han)料材料属性如表(biao)1、2所示。
3 焊料流动特性仿真结果
3.1 压力施加方(fang)法
SJ 21455-2018《集(ji)成电路陶瓷封装合(he)金烧结密封工(gong)艺(yi)技术要求》中提出,合(he)金烧结密封时需(xu)用(yong)夹(jia)具对盖(gai)板与外壳施加(jia)相应(ying)的压力,一(yi)般情况下(xia)会采用(yong)压块或夹(jia)子作为夹(jia)具[8-10],如图3、4所示。
相(xiang)比之下,压(ya)(ya)(ya)(ya)块和夹(jia)子提供(gong)压(ya)(ya)(ya)(ya)力(li)的(de)方式有所不(bu)同(tong)。压(ya)(ya)(ya)(ya)块夹(jia)具(ju)(ju)与(yu)盖(gai)(gai)(gai)板(ban)(ban)的(de)接(jie)(jie)触(chu)(chu)(chu)是(shi)(shi)面(mian)接(jie)(jie)触(chu)(chu)(chu),选用(yong)压(ya)(ya)(ya)(ya)块作(zuo)为夹(jia)具(ju)(ju)施(shi)加(jia)(jia)压(ya)(ya)(ya)(ya)力(li),可以获得更(geng)加(jia)(jia)均(jun)匀的(de)压(ya)(ya)(ya)(ya)力(li)分布(bu),以期(qi)待焊料在(zai)压(ya)(ya)(ya)(ya)力(li)作(zuo)用(yong)下均(jun)匀向(xiang)四周(zhou)流淌(tang),铺满整个(ge)密封区;夹(jia)子夹(jia)具(ju)(ju)与(yu)盖(gai)(gai)(gai)板(ban)(ban)的(de)接(jie)(jie)触(chu)(chu)(chu)可以看做是(shi)(shi)线接(jie)(jie)触(chu)(chu)(chu),压(ya)(ya)(ya)(ya)力(li)通(tong)过(guo)夹(jia)口(kou)所在(zai)的(de)直(zhi)线区域(yu)作(zuo)用(yong)于盖(gai)(gai)(gai)板(ban)(ban)上,通(tong)常(chang)再(zai)增加(jia)(jia)一个(ge)小垫片,将其(qi)转化(hua)为面(mian)接(jie)(jie)触(chu)(chu)(chu)。这时,如果(guo)所需施(shi)加(jia)(jia)的(de)密封压(ya)(ya)(ya)(ya)力(li)很大(da)(da),或者盖(gai)(gai)(gai)板(ban)(ban)尺寸过(guo)大(da)(da)(同(tong)等(deng)厚度下盖(gai)(gai)(gai)板(ban)(ban)越大(da)(da)越容(rong)易发生形变),则夹(jia)子夹(jia)具(ju)(ju)容(rong)易造成盖(gai)(gai)(gai)板(ban)(ban)中心悬空(kong)区域(yu)的(de)凹陷形变,而盖(gai)(gai)(gai)板(ban)(ban)四角微翘,这会(hui)导致焊料压(ya)(ya)(ya)(ya)力(li)入口(kou)的(de)压(ya)(ya)(ya)(ya)强分布(bu)不(bu)均(jun),使其(qi)流淌(tang)效(xiao)果(guo)与(yu)期(qi)望(wang)不(bu)相(xiang)符。
3.2 压(ya)块(kuai)流场仿(fang)真结果
首先(xian)对压(ya)(ya)块夹(jia)具施加压(ya)(ya)力的(de)情(qing)况开(kai)展仿真分析,设置压(ya)(ya)块提供的(de)压(ya)(ya)力为5 N。图5给出(chu)了(le)盖板与(yu)焊料接触(chu)面,即压(ya)力(li)入口(kou)的压(ya)力(li)分布情况。从图5中(zhong)可以(yi)看出,由于(yu)压(ya)块与盖(gai)板的面接(jie)触,焊(han)料压(ya)力入口界(jie)面上(shang)的节点获(huo)得了均(jun)匀的压(ya)力分布。
将压力分布作为载荷带入流(liu)体力学分析中,求解熔融焊料在压力载荷下的响应。图6给(ji)出了焊料速度(du)分布图,从(cong)图6中可(ke)以看出,焊料的环型区(qu)域内流速较为均匀(yun),但(dan)在焊料环的四(si)角处(chu),流速最(zui)大值达到1.42×10-5m/s,这(zhei)一数值(zhi)达到(dao)了(le)焊料(liao)环形(xing)区(qu)域流速的2~3倍。
进(jin)一步,我们从速度矢量的(de)角度去分析焊料在均(jun)匀(yun)压力下的(de)流淌情况。图7为(wei)速度(du)矢量图,从(cong)图7中可以(yi)看出,焊(han)料环形区域(yu)(yu)(例如四边的中心区域(yu)(yu)),熔融焊(han)料的主要流向(xiang)是朝向(xiang)腔体外部的,数值(zhi)为4.27×10-6m/s,这有利于熔融焊料(liao)向外铺(pu)展,也(ye)能观察到朝向腔体内部的速度(du)矢量,其数值为1.42×10-6m/s,这(zhei)有利(li)于熔融焊(han)料向内铺展(zhan);而在(zai)四(si)角区域,熔融焊(han)料的(de)(de)速度矢量(liang)是近似于垂直(zhi)外壳向下的(de)(de),朝向腔体(ti)外部的(de)(de)分(fen)量(liang)很小,这(zhei)说明焊(han)料的(de)(de)四(si)角区域是不易在(zai)密封区形成铺展(zhan)的(de)(de)。
虽然(ran)压(ya)块提(ti)供了均匀分布(bu)的(de)(de)压(ya)力(li),压(ya)力(li)也(ye)转化成(cheng)(cheng)了均匀分布(bu)的(de)(de)速度,使得焊料能够(gou)向(xiang)内和(he)(he)向(xiang)外形成(cheng)(cheng)铺(pu)(pu)展(zhan)和(he)(he)润湿,铺(pu)(pu)满(man)整个(ge)密封区(qu)域(yu),但是(shi)基于非牛(niu)顿流体的(de)(de)流固耦合仿真(zhen)结果可以看(kan)出(chu),熔(rong)融焊料铺(pu)(pu)展(zhan)能力(li)的(de)(de)薄弱(ruo)区(qu)域(yu)出(chu)现在了焊料环的(de)(de)四角处,该区(qu)域(yu)向(xiang)外铺(pu)(pu)展(zhan)的(de)(de)速度矢量很小,这是(shi)该区(qu)域(yu)常(chang)见密封空洞的(de)(de)主(zhu)要原因之一。
3.3 夹(jia)子(zi)流场(chang)仿真结果
对夹子夹具施加(jia)压(ya)力(li)的情况开展仿真分析(xi),也(ye)将压(ya)力(li)设置为(wei)5 N。图8为结(jie)构力学(xue)的(de)仿真结(jie)果。从(cong)图8中可以看出,盖板最大形变值1.5761×10-7m,最小形变(bian)1.3248×10-10m,相差(cha)3个数量级,如图8(a)所示,这是由于夹具完全作(zuo)用在空腔上,盖(gai)板(ban)发生了微形(xing)变,并以梯度的形(xing)式从中心(xin)向四周传递;此(ci)时,盖(gai)板(ban)上的最大应力2.2262×106Pa,最小应(ying)力127.77Pa,如图8(b)所(suo)示;盖板的形变翘曲引(yin)起(qi)了盖板与焊(han)料环接触面之间压力的非均匀传递,如图8(c)所示,作用在焊料环上的最大(da)应(ying)力为1.7450×106Pa,位于(yu)焊料(liao)环(huan)内(nei)边界(jie)上(shang),这将引起焊料(liao)受到向(xiang)腔体外侧流动的(de)强作用力,而最小(xiao)应力为1516.9Pa,分布在(zai)焊(han)(han)料环的四角(jiao)区域(yu)。这(zhei)表明,夹子提供(gong)的密(mi)封压(ya)力向焊(han)(han)料环四边传(chuan)递充分;但在(zai)焊(han)(han)料环四角(jiao)区域(yu),熔融(rong)焊(han)(han)料难以受到密(mi)封压(ya)力的作用。从(cong)以往的试验(yan)可知(zhi),金锡焊(han)(han)料与(yu)外(wai)壳、盖(gai)板镀金层的润湿角(jiao)较大,属于只润湿不铺展类(lei)型,因此,在(zai)没有(you)(you)外(wai)界(jie)密(mi)封压(ya)力的驱动下(xia),难以有(you)(you)效浸润,容(rong)易形成(cheng)密(mi)封空(kong)洞。
为了更清晰地解释非(fei)均匀压(ya)力作用下熔(rong)融焊料的(de)流(liu)(liu)动(dong),我们进一步通过流(liu)(liu)固(gu)耦合(he),从速度矢量(liang)角度去分析焊料的(de)流(liu)(liu)淌(tang)情况,如图(tu)9所示(shi)。从图(tu)9中(zhong)可以看出,熔融焊(han)料(liao)在非均匀压力作用(yong)下,在焊(han)料(liao)环四(si)边、四(si)角(jiao)(jiao)和(he)边角(jiao)(jiao)交接区域(yu)表(biao)现出不同的流淌特性。
从边(bian)(bian)角(jiao)(jiao)结(jie)合区(qu)域(yu)(yu)来看,仿真速(su)度矢量的(de)最大值出现在这(zhei)个(ge)区(qu)域(yu)(yu)。熔(rong)(rong)融(rong)焊料(liao)在这(zhei)个(ge)区(qu)域(yu)(yu)获(huo)得了(le)较大的(de)流速(su),流向(xiang)从四(si)(si)边(bian)(bian)指向(xiang)四(si)(si)角(jiao)(jiao)并伴随(sui)着向(xiang)腔体外侧的(de)分量。这(zhei)种(zhong)情况将导致焊料(liao)从四(si)(si)边(bian)(bian)向(xiang)四(si)(si)角(jiao)(jiao)流动。这(zhei)与压块夹具(ju)提供均(jun)匀(yun)压力情况下(xia)产生的(de)流淌(tang)不同。在均(jun)匀(yun)压力作(zuo)用下(xia),熔(rong)(rong)融(rong)焊料(liao)表现出垂直向(xiang)腔体内、外的(de)流淌(tang)。而(er)在非均(jun)匀(yun)压力下(xia),熔(rong)(rong)融(rong)焊料(liao)具(ju)有(you)了(le)沿(yan)着焊料(liao)环内部(bu)流淌(tang)的(de)趋(qu)势,焊料(liao)从四(si)(si)边(bian)(bian)区(qu)域(yu)(yu)被挤压到四(si)(si)角(jiao)(jiao)区(qu)域(yu)(yu)。在这(zhei)种(zhong)情况下(xia),四(si)(si)边(bian)(bian)焊料(liao)减少,密封后该区(qu)域(yu)(yu)焊料(liao)厚度变(bian)薄,密封可靠性下(xia)降(jiang)。另(ling)一方面,四(si)(si)角(jiao)(jiao)区(qu)域(yu)(yu)获(huo)得了(le)部(bu)分来自(zi)于(yu)四(si)(si)边(bian)(bian)区(qu)域(yu)(yu)的(de)熔(rong)(rong)融(rong)焊料(liao),这(zhei)种(zhong)流淌(tang)难以控制,并不在设计预期之内。
从(cong)四边来看,熔融焊料受到盖板传递(di)的压力,获(huo)得了垂直于焊料环向下的速度矢量,其(qi)数值为(wei)8.284×10-8m/s,这个数值极小,说明焊(han)(han)料(liao)(liao)在此(ci)区(qu)域的流动内(nei)驱动力不足,这不利于(yu)焊(han)(han)料(liao)(liao)向(xiang)密(mi)封区(qu)内(nei)、外两个方(fang)向(xiang)润湿(shi)和铺(pu)展。这主要是因为(wei),由于(yu)压力的不均匀分布,四边焊(han)(han)料(liao)(liao)被挤流向(xiang)四角,使(shi)得四边区(qu)域焊(han)(han)料(liao)(liao)量减(jian)少,焊(han)(han)料(liao)(liao)变薄,此(ci)区(qu)域焊(han)(han)料(liao)(liao)不充分,无法按照(zhao)设计预期向(xiang)腔体内(nei)和腔体外有效铺(pu)展。
从四(si)角区域(yu)来看,虽然获得(de)了部(bu)分熔融焊(han)(han)料(liao),但是(shi)其流淌驱动(dong)力仅来源于四(si)边焊(han)(han)料(liao)向四(si)角焊(han)(han)料(liao)流动(dong)的流体内部(bu)压(ya)强;而密(mi)封(feng)夹具(ju)提供(gong)的压(ya)力在(zai)四(si)角区域(yu)没有产生预(yu)(yu)期(qi)作用(yong)。由于金锡焊(han)(han)料(liao)的粘塑(su)性,非牛(niu)顿流体在(zai)四(si)角区表现(xian)(xian)出(chu)较差的铺展能力,焊(han)(han)料(liao)环(huan)熔化后不能按(an)照预(yu)(yu)期(qi)向腔内和(he)腔外铺展到(dao)整个(ge)密(mi)封(feng)区域(yu),这也将(jiang)导致密(mi)封(feng)后密(mi)封(feng)区的四(si)角区域(yu)出(chu)现(xian)(xian)空洞。
4 分析与讨论(lun)
基于非牛顿流体力学,对比不同夹具(ju)夹持(chi)状态下AuSn密封(feng)焊料熔化后的(de)流淌趋势,阐(chan)述(shu)典型密封(feng)压(ya)力条件(jian)下密封(feng)过程四角空洞的(de)形成(cheng)机理。
4.1 压块夹(jia)具
压(ya)块夹具通过对盖(gai)板(ban)(ban)均(jun)匀施加压(ya)力,避免盖(gai)板(ban)(ban)形变,从而(er)使得盖(gai)板(ban)(ban)对焊料环传(chuan)递了(le)均(jun)匀的压(ya)力,使得熔融焊料可(ke)以较好地同时向腔(qiang)体内和腔(qiang)体外两个方向铺展。但是,由基于非牛顿流体的流固(gu)耦(ou)合仿真结果可(ke)以看出,焊料在(zai)四角区域铺展能力较弱,这是该区域常见密封空(kong)洞的重要原因。
4.2 夹子夹具(ju)
夹(jia)子(zi)夹(jia)具对盖(gai)(gai)板(ban)施加压力时,由于夹(jia)具完全作用(yong)在空(kong)腔上,盖(gai)(gai)板(ban)发生了微形(xing)变(bian)。盖(gai)(gai)板(ban)的(de)(de)形(xing)变(bian)翘曲引起了盖(gai)(gai)板(ban)与焊料环(huan)(huan)接触面(mian)之间压力的(de)(de)非均匀传递。在焊料环(huan)(huan)四个边上,焊料受到(dao)向腔体(ti)外侧(ce)流动的(de)(de)强作用(yong)力,而焊料环(huan)(huan)的(de)(de)四角区域难以受到(dao)密封压力的(de)(de)作用(yong),这使得焊料在四角区域往往难以有效浸润,这是该区域容易形(xing)成密封空(kong)洞的(de)(de)原因之一(yi)。
综上可以(yi)看(kan)出,四(si)角空(kong)洞(dong)是由(you)密(mi)(mi)封(feng)夹(jia)具、密(mi)(mi)封(feng)压力所(suo)(suo)产生的一(yi)种最基(ji)本的密(mi)(mi)封(feng)空(kong)洞(dong)。在所(suo)(suo)封(feng)电路(lu)尺寸较大,或所(suo)(suo)需(xu)密(mi)(mi)封(feng)压力较大,或所(suo)(suo)封(feng)电路(lu)的盖(gai)板较薄,或密(mi)(mi)封(feng)区较宽时,焊(han)料(liao)环(huan)四(si)角区域(yu)流淌性低于(yu)四(si)边区域(yu),造成焊(han)料(liao)整体铺展不均(jun)匀的现象更加显(xian)著,密(mi)(mi)封(feng)空(kong)洞(dong)多发,如图10所(suo)示。通常的工(gong)艺试(shi)验会增加密(mi)封(feng)压力来(lai)提(ti)高(gao)焊(han)料(liao)铺展(zhan)性,以期待通过挤压促进焊(han)料(liao)填缝,弥补空(kong)洞。但(dan)是在上述提(ti)到的情况下,不但(dan)不能(neng)通过增加压力来(lai)提(ti)高(gao)四角区域(yu)的焊(han)料(liao)铺展(zhan)能(neng)力,还会导致原本已(yi)经良好铺展(zhan)的区域(yu)发生焊(han)料(liao)溢出,引发PIND和爬盖问题(ti)。因此,在有必要(yao)时,应(ying)根据需要(yao)对典型的(de)压(ya)力施(shi)加方式进(jin)行改进(jin)。在分(fen)析密封(feng)(feng)(feng)空洞时,不仅(jin)仅(jin)着眼于密封(feng)(feng)(feng)压(ya)力的(de)均(jun)匀施(shi)加,更应(ying)该深入考虑的(de)是焊(han)料最终的(de)流(liu)速和流(liu)动(dong)方向(xiang),这是一(yi)个密封(feng)(feng)(feng)区结(jie)构设计(ji)与密封(feng)(feng)(feng)工艺参数优化相结(jie)合的(de)复(fu)杂问题(ti)。
5 结 论
基于非牛(niu)顿流(liu)体力学,对比(bi)了压块和夹(jia)子两种不同夹(jia)具夹(jia)持状态(tai)下AuSn20密(mi)封焊(han)料(liao)熔化后的(de)流淌趋势,发现压(ya)块(kuai)可以(yi)使(shi)焊(han)料(liao)环获得均(jun)匀(yun)压(ya)力(li)(li)(li),而夹子产生非均(jun)匀(yun)压(ya)力(li)(li)(li),四角处焊(han)料(liao)压(ya)力(li)(li)(li)较(jiao)小,熔化后流速较(jiao)小,润湿能(neng)力(li)(li)(li)相对较(jiao)差(cha),说(shuo)明其是密(mi)封四角空洞(dong)的(de)形成机(ji)理(li)之(zhi)一。
参考文献:(略(lve))
免责(ze)(ze)申明:本文(wen)(wen)内容转自:《电子(zi)与封装》,作者(zhe)(zhe):赵鹤然,李(li)俐莹(ying),陈明祥。文(wen)(wen)字、素材、图片版权等(deng)内容属(shu)于(yu)原(yuan)作者(zhe)(zhe),本站转载内容仅供(gong)大家分(fen)享学习(xi)。如果侵害了原(yuan)著作人的合法权益,请及(ji)时与我们联系,我们会(hui)安(an)排删除(chu)相关内容。本文(wen)(wen)内容为(wei)原(yuan)作者(zhe)(zhe)观点(dian),并(bing)不(bu)代表我们赞同其观点(dian)和(或)对其真实性负责(ze)(ze)。
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(COG)、铟焊(han)(han)(han)(han)(han)料(liao)封(feng)(feng)装(zhuang)(zhuang)(zhuang)(zhuang)(zhuang)、共(gong)(gong)晶(jing)焊(han)(han)(han)(han)(han)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)烧(shao)结(jie)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)共(gong)(gong)晶(jing)烧(shao)结(jie)、共(gong)(gong)晶(jing)键合、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)薄(bo)(bo)(bo)膜、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)合金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)薄(bo)(bo)(bo)膜、合金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)焊(han)(han)(han)(han)(han)料(liao)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)焊(han)(han)(han)(han)(han)料(liao)、Au50Cu50焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Au焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Au88Ge12焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Au99Sb1焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、Sn焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、激(ji)光巴(ba)(ba)条(tiao)(tiao)(tiao)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)共(gong)(gong)晶(jing)焊(han)(han)(han)(han)(han)、激(ji)光巴(ba)(ba)条(tiao)(tiao)(tiao)焊(han)(han)(han)(han)(han)接材料(liao)、背金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)盖板、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)壳体、预(yu)置(zhi)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)壳体、预(yu)置(zhi)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)盖板、预(yu)涂焊(han)(han)(han)(han)(han)料(liao)盖板、贴(tie)膜包装(zhuang)(zhuang)(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、覆膜预(yu)成(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)薄(bo)(bo)(bo)膜热(re)沉(chen)(chen)(chen)(chen)(chen)、钨铜金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)热(re)沉(chen)(chen)(chen)(chen)(chen)、SMT用预(yu)成(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、载(zai)带式预(yu)成(cheng)(cheng)形(xing)(xing)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)(xi)银(yin)(yin)(yin)(yin)焊(han)(han)(han)(han)(han)料(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)(xi)锑焊(han)(han)(han)(han)(han)料(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、中高(gao)温(wen)(wen)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、异形(xing)(xing)焊(han)(han)(han)(han)(han)料(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、IGBT焊(han)(han)(han)(han)(han)料(liao)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、焊(han)(han)(han)(han)(han)锡(xi)(xi)(xi)(xi)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、预(yu)成(cheng)(cheng)型锡(xi)(xi)(xi)(xi)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)焊(han)(han)(han)(han)(han)膏(gao)(gao)(gao)、纳米(mi)银(yin)(yin)(yin)(yin)锡(xi)(xi)(xi)(xi)膏(gao)(gao)(gao)、微(wei)组装(zhuang)(zhuang)(zhuang)(zhuang)(zhuang)焊(han)(han)(han)(han)(han)料(liao)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)凸(tu)点、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)bump、激(ji)光巴(ba)(ba)条(tiao)(tiao)(tiao)共(gong)(gong)晶(jing)、Au80Sn20、AuSn Solder、晶(jing)振金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)封(feng)(feng)盖、电镀(du)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)、flux coating solder、共(gong)(gong)晶(jing)贴(tie)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、铟铅(qian)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、铟铅(qian)合金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)、锡(xi)(xi)(xi)(xi)铋(bi)焊(han)(han)(han)(han)(han)片(pian)(pian)(pian)(pian)(pian)(pian)(pian)(pian)、锡(xi)(xi)(xi)(xi)铋(bi)焊(han)(han)(han)(han)(han)料(liao)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)薄(bo)(bo)(bo)膜电路、ALN热(re)沉(chen)(chen)(chen)(chen)(chen)、氮化铝热(re)沉(chen)(chen)(chen)(chen)(chen)、碳化硅(gui)金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)热(re)沉(chen)(chen)(chen)(chen)(chen)、SiC金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)锡(xi)(xi)(xi)(xi)热(re)沉(chen)(chen)(chen)(chen)(chen)、金(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)(jin)刚(gang)石热(re)沉(chen)(chen)(chen)(chen)(chen)、硅(gui)基热(re)沉(chen)(chen)(chen)(chen)(chen)、CMC热(re)沉(chen)(chen)(chen)(chen)(chen)、CPC热(re)沉(chen)(chen)(chen)(chen)(chen)。
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